Home > 通知公告 > Congratulations! Wang Yarong’s paper published at IEEE ELECTRON DEVICES TECHNOLOGY AND MANUFACTURING conference

From March 16th to 18th, 2020, due to the impact of the epidemic, Wang Yarong attended the 2020 IEEE EDTM (Electron Devices Technology and Manufacturing) meeting originally scheduled to be held in Penang, Malaysia, and published a title entitled “A Novel Viscous Shear Stress Method for Aligning Single-Walled Carbon Nanotubes”.

“During the epidemic period, although we can only learn online, we also benefited a lot,” Wang said, “This conference covered many fields such as electronic device manufacturing and materials, and I have learned a lot. I especially thank Mr. Zhang for her online guidance during the epidemic! “”

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